World class silicones for worldwide solutions

AS1500


Downloads Request Sample
TDS
SDS
Description
1 part Industrial Adhesive Sealant
Feature
  • Fast curing at room temperature
  • Flexible from -60°C/140°F to +300°C/572°F
  • Excellent adhesion to many substrates
  • Non slumping paste
Code
AS1500
Feature
Feature 1
Fast curing at room temperature
Feature 2
Flexible from -60°C/140°F to +300°C/572°F
Feature 3
Excellent adhesion to many substrates
Feature 4
Non slumping paste
100% Modulus (N/mm2)
1 MPa
Appearance
Thixotropic paste
Color
White
CTE Linear ppm/°C
292 ppm / °C
CTE Volumetric ppm/°C
876 ppm/°C
Cure Profile
23+/-2°C and 50+/-5% humidity
Cure Through to 3 mm Depth
7 hr
Cure Type
Acetoxy
Density
1.07 g/cm3
Dielectric Constant
3
Dielectric Strength (V/mil)
457 V/mil
Dielectric Strength kV/mm
18 kV/mm
Dissipation Factor
0.0025
Elongation at Break
270 %
Extrusion Rate g/min
295 g/min
Hardness Shore A
39
Linear Shrinkage (%)
1 %
Max Storage Temperature
40 °C
Max Working Temp
300 °C
Min Working Temp
-50 °C
Rheology
Paste
RTV or Heat cure
RTV
Self Bonding
Yes
Shelf Life
24 mths
Tack Free Time / Skin Formation at 23°C/73°F
3 min
Tear Resistance (N/mm)
6.1 N/mm
Tensile Strength
2.4 N/mm2
Test Conditions
7 days at 23+/-2°C and 50+/-5% humidity
Thermal Conductivity
0.2 W/mK
Volume Resistivity (Ohms cm)
3.21E+15 ohms cm
Youngs Modulus (N/mm2)
0.75 N/mm2
Back to top
X
Any questions, let us know!
Request more information
Request a sample