World class silicones for worldwide solutions

QSil553


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TDS
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SDS B
Description
SILCOTHERM 2 Part Addition cure silicone encapsulant
Feature
  • Thermally conductive
  • UL94 V0 Approved file No. E205830
  • Low modulus
  • 1:1 Mix Ratio
Code
QSil553
Sub Group
None
Feature
Feature 1
Thermally conductive
Feature 2
UL94 V0 Approved file No. E205830
Feature 3
Low modulus
Feature 4
1:1 Mix Ratio
Old Code
QSil553
Appearance
Viscous Liquid
Test Conditions
After 15 minutes at 150°C
Colour
Grey
Colour A Part
Beige
Colour B Part
Black
SG
1.63
SG A Part
1.6
SG B Part
1.6
Min Working Temp - °C
-55 °C
Max Working Temp +°C
260 °C
FDA
No
Shelf life
24 mths
Max storage temperature °C
30 °C
Pack Type
2-Part Kit
Mix Ratio
1:1
Rheology
Liquid
Viscosity A-Part mPas
6000 mPas
Viscosity B-Part mPas
6000 mPas
Viscosity Mixed mPas
6000 mPas
Non Corrosive
Yes
Cure Type
Addition
RTV or Heat cure
Heat Acclerated RTV
Self Bonding
No
UL 94V-0
Yes
Duro Shore A
45
Tensile MPa
1.72 MPa
Elongation %
240 %
Tear kN/m
7.8 kN/m
Modulus @ 100% Strain MPa
1.24 MPa
CTE Volumetric ppm/°C
650 ppm/°C
CTE Linear ppm/°C
217 ppm/°C
Max Cure Hrs @ 25 °C
24 hrs
Max Cure Mins @ 100 °C
7 mins
Thermal Conductivity W/mK
0.68 W/mK
Volume Resistivity ohms cm
4.02E+14 ohms cm
Dielectric Strength kV/mm
>18 kV/mm
Dielectric Constant @ 1kHz
3.08
Dissipation Factor @ 1kHz
0.009
Pot Life mins
100 mins
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