Our new SILCOTHERM® SE3001 silicone encapsulant has been added to our thermally conductive range to complement our SE3000 product. These materials are both room temperature curing but can be accelerated with heat.
With an increased thermal conductivity rating of 2.54 W/mK, SE3001 is ideal for use in potting sensitive electronic components where heat dissipation is important, particularly in applications such as automotive and aerospace electronics.
Key features & benefits:
- High thermal conductivity rating - 2.54 W/mK
- Easy 1:1 mix ratio
- Compatible with very sensitive electronic components
- Excellent flowablity means there is a reduced risk of air pockets resulting in better heat dissipation
- High working temperature – 204°C