SILCOTHERM® thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. They also provide protection from harsh environments, vibration and thermal shock. Addition cure silicones provide deep section cure allowing for complete encapsulation for environmental protection whilst maintaining an effective heat path.
Protection of components in:
|AS1406||SILCOTHERM 1 Part flowable heat cured silicone adhesive sealant|
|AS1421||SILCOTHERM 1 Part flowable heat cured 2.1 W/mK silicone adhesive|
|QSil553||SILCOTHERM 2 Part Addition cure silicone encapsulant|
|QSil573||SILCOTHERM 2 Part Addition cure silicone encapsulant|
|SE2003||SILCOTHERM 2 Part Addition cure silicone encapsulant|
|SE3000||SILCOTHERM 2 Part Addition cure low viscosity|