SILCOTHERM® non-setting silicone greases or compounds are designed to improve thermal transfer at the interface between processor and heat sink. They work by removing insulating air gaps and improving heat dissipation through the use of conductive fillers. Processor performance is thereby optimised and working life extended.
In addition to the obvious use with processors these versatile compounds can be employed wherever there is a need to dissipate heat without forming a permanent bond between the two surfaces.
ACC have two standard materials:
SILCOTHERM® SG500 with a thermal conductivity of 0.77 W/mK
SILCOTHERM® SG502 with a thermal conductivity of 3.00 W/mK
Download the ACC Silicones Thermal Transfer application guide